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TLP104 2015 - 10- 16 1 toshiba photocoupler gaa ? as led & photo - ic tlp 10 4 i pm (intelligent power module) industrial inverter operate at high ambient temperatures up to 125 c the toshiba tlp 1 04 consists of gaa ? as infrared light emitting diodes and integrated high gain, high - speed photodetectors. the TLP104 is housed in the so 6 package . the output stage is an open collector type. the photodetector has an internal faraday shield that provides a guaranteed common - mode transient immunity of 15 kv/ s. tlp 1 04 guarantees minimum and maximum of propagation delay time, switching speed dispersion, and high common mode transient immunity. therefore tlp 1 04 is suitable for isolation interface between ipm (intelligent power module) in motor control application. ? inverter logic type (open collector output) ? package type: so6 ? guaranteed performance over temperature : -40 to 125 c ? power supply voltage: - 0.5 to 30 v ? threshold input current: i fhl = 5.0 ma (max) ? propagation delay time (t ph l /t p lh ): t ph l = 400 ns ( max ) t p lh = 550 ns ( max ) ? switching time dispersion (|t phl -t plh |) : 400ns (max) ? common mode transient immunity : 15kv/ s (m in ) ? isolation voltage : 3750vrms ( min ) ? ul approved : ul1577, file no.e67349 ? c-ul approved : csa component acceptance service no. 5a , file no.e 67349 ? option (v 4) vde approved : din en60747 -5-5 ( note ) ? cqc - approved: gb4943.1, gb8898 thailand factory note : when a en60747 -5-5 approved type is needed, please designate option(v4) truth table input led output h on l l off h jedec D jeita D toshiba 11 - 4l1 weight: 0.08 g ( typ. ) unit: mm 1: anode 3: cathode 4:gnd 5 :v o (output) 6: v cc v cc gnd shield 1 3 4 5 6 pin configuration (top view) v cc gnd i cc 6 4 shield 3 - 1 + if io io v o 5 schematic construction mechanical ratings creepage distance 5 .0 mm ( min ) clearance distance 5 .0 mm ( min ) nsulation thickness 0.4 mm ( min ) start of commercial production 2009 - 10
TLP104 201 5- 10 -16 2 absolute maximum ratings (ta = 25 c) characteristic symbol rating unit le d forward current i f 25 ma forward c urrent derating (ta i i c lead solder ing temperature (10 s) t sol 260 10 s, duty= 1 0% . note 2 : this d evice is regarded as a two terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. recommended operating conditions characteristic symbol min typ . max unit input current , high level i f hl 7.5 - 1 5 ma input voltage , low level v f lh 0 - 0.8 v supply voltage * v cc 4.5 - 3 0 v operating temperature t opr - 40 - 125 c * this item denotes operating range, not meaning of recommended operating conditions. note: recommended operating conditions are given as a design guideline to obtain expected performance of the device. additionally, each item is an independent guideline respectively. in developing designs using this product, please confirm specified characteristics shown in this document.
TLP104 201 5- 10 -16 3 electrical characteristics (unless otherwise specified, ta = ? 40 to 1 25 c, v cc =4.5 to 30v) characteristic symbol test circuit test condition min typ. max unit led forward voltag e v f D i f = 10 ma , ta=25 c 1. 45 1.61 1. 85 v forward voltage temperature coefficient v f / ta D i f = 1 0 ma D - 1.8 D mv / c reverse current i r D v r = 5 v , ta=25 c D D 10 a capacitance between terminals c t D v = 0 v , f = 1 mhz D 60 D pf detector high level output current i oh v f = 0 .8 v, v o < v cc D D 50 a low level output voltage v ol 2 i f = 10 ma, i o = 2.4ma D 0.2 0.6 v low level supply current i ccl 3 i f = 10 ma D D 1.3 ma high level supply current i cch 4 i f = 0 ma D D 1 .3 ma output current i o D i f = 10 ma, v o = 0.6v 4.0 D D ma input current logic low output i fhl D i o = 0.75ma, v o < 0.8 v D 1.0 5 ma input voltage logic high output v flh D i o = 0.75ma, v o > 2.0 v 0.8 D D v * all typical values are at ta=25 c, v cc =5 v unless otherwise specified isolation characteristics (ta = 25 c ) characteristic symbol test conditions min typ. max unit capacitance input to output c s v s = 0 v, f = 1 mhz D 0.8 D pf isolation resistance r s r.h. 60%, v s = 500 v 1 10 12 10 14 D isolation voltage bv s ac ,60 s 3750 D D v rms ac ,1 s, in oil D 10000 D dc, 60 s , in oil D 10000 D v dc
TLP104 201 5- 10 -16 4 switching characteristics ( unless otherwise specified, ta = ? 40 to 1 25c , v cc =15v) characteristic symbol test circuit test condition min typ. max unit propagation delay time (h l) t phl 5 i f = 10 ma, r l = 20k (note 1) c l =100pf 30 15 0 400 ns c l =10pf D 90 D propagation delay time (l h) t plh c l =100pf 15 0 350 550 c l =10pf D 100 D switching time dispersion between on and off |t ph l ? t plh | c l =100pf D D 400 propagation delay skew (note 2) t plh ? t phl - 50 D 450 common mode transient immunity at high output level cm h 6 v cm = 1500 v p ? p , i f = 0 ma r l = 20 k , ta=25 c 15 D D k v/ s common mode transient i mmunity at low output level cm l v cm = 1500 v p ? p, i f = 10 ma r l = 20 k , ta=25 c ? 15 D D k v/ s *all typical values are at ta= 25 c note : a ceramic capacitor (0.1 f) should be connected from pin 6 ( v cc ) to pin 4 (gnd) to stabilize the operation of the high gain linear amplifier. failure to provide the bypass may impair the switching property. the total lead length between capacitor and coupler should not exceed 1 cm. note 1: f = 10k hz, duty= 1 0%, input current tr = tf = 5ns note 2 : propagation delay skew is defined as the propagation delay time of the largest or smallest t plh minus the largest or smallest t phl of multiple samples. evaluations of these samples are conducted under identical test conditions (supply voltage, input current, temperature, etc .). test circuit 1: i oh test circuit 2: v ol test circuit 3: i ccl test circuit 4: i cch i f a v cc 0.1 f i ccl 0.1
TLP104 201 5- 10 -16 5 test circuit 5 : t ph l , t plh , |t phl -t plh | test circuit 6 : cm h , cm l v o v ol t pl h t ph l vthhl= 1.5 v 50% i f 0.1 f rin=100 15pf * c l r l = 20k if monitor v o p. g . shield v cc vthlh=2.0 v v cm 10% 90% 15 00 v ? sw b : i f = 0 ma ? sw a : i f = 10 ma 1.0 v 11v v o t r t f cm l cm h f i f a r l = 2 0 k cm h 1200(v) t r(s) cm l - 1200(v) t f(s) *: probe and stray capacitance. p.g.: pulse generator
TLP104 201 5- 10 -16 6 f - f i fhl - t a input forward current i f (ma) input current logic low output i fhl (m a) input forward voltage v f ( v ) mbient temperature ta ( c ) i ccl - t a i cch - t a low level supply current i ccl (m a) hi gh level supply curre n t cch (m ) mbient temperature ta ( c ) mbient temperature ta ( c ) l - t a h - t a low level output voltage l () high level output current h ( a) mbient temperature ta ( c ) mbient temperature ta ( c ) *: the above graphs show typical characteristics. 0.1 1 10 100 1 1.2 1.4 1.6 1.8 2 2. 2 0 1 2 3 4 5 - 40 - 20 0 20 40 60 80 100 120 140 0 0.2 0.4 0.6 0.8 1 1.2 1.4 - 40 - 20 0 20 40 60 80 100 120 140 0 0.2 0.4 0.6 0.8 1 1.2 1.4 - 40 - 20 0 20 40 60 80 100 120 140 0 0.1 0.2 0.3 0.4 0.5 0.6 - 40 - 20 0 20 40 60 80 100 120 140 0 0.4 0.8 1.2 1.6 2 - 40 - 20 0 20 40 60 80 100 120 140 v cc = 30 v v cc = 1 5 v io = 0.75 ma v o < 0.8 v v cc = 30 v i f = 10 ma ta= 1 25 ?c ?c ?c ?c ?c ?c ?c ?c
TLP104 201 5- 10 -16 7 t ph l /t plh / | t plh - t p hl | - c l t ph l / t p l h /| t plh - t p hl | - ta propagation delay time , switching time dispersion between on and off t ph l , t pl h, |t p lh -t p h l | (ns) propagation delay time , switching time dispersion between n and ff t ph l , t pl h, t p lh -t phl (ns) lord capacitance c l ( pf ) mbient temperature ta ( c ) t ph l / t p l h / t plh - t p hl - f t ph l / t p l h / t plh - t p hl - cc propagation delay time switching time dispersion between on and off t ph l , t pl h, |t p lh -t p h l | (ns) propagation delay time , switching time dispersion between n and ff t ph l , t pl h, t p lh -t phl (ns) nput forward current f ( m ) supply voltage cc ( ) t ph l /t plh / t plh - t p hl - r l t ph l /t plh / t plh - t p hl - r l propagation delay time , switching time dispersion between n and ff t phl, t plh, t plh - t phl (ns) propagation delay time , switching time dispersion between n and ff t phl, t plh, t plh -t phl (ns) lord resistance r l ( k lord resistance r l ( k *: the above graphs show typical characteristics. 0 400 800 1200 1600 2000 0 100 200 300 400 500 600 700 0 100 200 300 400 500 - 40 - 20 0 20 40 60 80 100 120 140 0 100 200 300 400 500 0 5 10 15 20 - 200 0 200 400 600 800 1000 1200 1400 0 5 10 15 20 25 30 0 200 400 600 800 1000 0 10 20 30 40 50 0 100 200 300 400 500 0 5 10 15 20 t phl i f = 10 ma, c l = 100 pf, r l = 20k
TLP104 201 5- 10 -16 8 precautions of surface mounting type photocoupler soldering & general storage ? precautions for soldering the soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. 1) when using soldering reflow the soldering temperature profile is based on the package surface temperature. (see the figure shown below, which is based on the package surface temperature.) an example of a temperature profile when lead (pb)- free solder is used ? reflow soldering must be performed once or twice. ? the mounting should be completed with the interval from the first to the last mountings being 2 weeks. 2) when using soldering flow ? apply preheatin g of 150 c for 60 to 120 seconds. ? mounting condition of 260 c or less within 10 seconds is recommended. ? flow soldering must be performed once 3) when using soldering iron ? complete soldering within 10 seconds for lead temperature not exceeding 260 c or within 3 seconds not exceeding 350 c. ? heating by soldering iron must be only once per 1 lead
TLP104 201 5- 10 -16 9 (2) precautions for general storage 1) do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) when transportation or storage of devices, follow the cautions indicated on the carton box. 3) the storage area temperature should be kept within a temperature range of 5 c to 35 c, and relative humidity should be maintained at between 45% and 75%. 4) do not store devices in the presence of harmful (especially corrosive) gases, or in dusty conditions. 5) use storage areas where there is minimal temperature fluctuation. because rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) when repacking devices, use anti - static containers. 7) do not apply any external force or load directly to devices while they are in storage. 8) if devices have been stored for more than two years, even though the above conditions have been followed, it is recommended that solderability of them should be tested before they are used.
TLP104 201 5- 10 -16 10 specification for embossed C tape packing (tpl)(tpr) for so6 coupler 1. applicable package package product type so6 mini - flat coupler 2. product naming system type of package used for shipment is denoted by a symbol suffix after a product number. the method of classification is as below. ( example ) tlp10 4 (tpl, e [[g]]/rohs compatible ( note 1) tape - type de vice - name note 1: please contact your toshiba sales representative for details on environmental informa tion such as the product's rohs compatibility . rohs is the directive 2011/65/eu of the european parliament and o f the council of 8 june 2011 on the restriction of the use of certain hazardous substances in electrical and electronics equipment. 3. tape dimensions 3.1 specification classification are as shown in table 1 table 1 tape type classification tape type classification quantity (pcs / reel) tpl l direction 3000 tpr r direction 3000 3.2 orientation of device in relation to direction of tape movement device orientation in the recesses is as shown in figure 1. figure 1 device orientation direction of tape l direction r direction
TLP104 201 5- 10 -16 11 3.3 empty device recesses are as shown in table 2. table 2 empty device recesses standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40 - mm section of tape, not including leader and trailer single empty device recesses 6 devices (max) per reel n ot including leader and trailer 3.4 start and end of tape the start of the tape has 50 or more empty holes. the end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 tape specification (1) tape material: plastic (protection against electrostatics) (2) dimensions: the tape dimensions are as shown in figure 2 and table 3. figure 2 tape forms table 3 tape dimensions unit: mm unless otherwise specified: 0.1 symbol dimension remark a 4. 0 D b 7.6 D d 5.5 center line of indented square hole and sprocket hole e 1.75 distance between tape edge and hole center f 8.0 cumulative error (max) per 10 feed holes g 4.0 cumulative error (max) per 10 feed holes k 0 2. 6 internal space + 0.1 - 0.3 + 0.1 - 0.3 0.3 0.05 2.95 0.2 k 0 g f e d b 12.0 + ? unit: mm
TLP104 201 5- 10 -16 12 3.6 reel (1) material: plastic (2) dimensions: the reel dimensions are as shown in figure 3 and table 4. figure 3 reel form table 4 reel dimensions unit: mm symbol dimension a 380 2 b 80 1 c 13 0.5 e 2.0 0.5 u 4.0 0.5 w1 13.5 0.5 w2 17.5 1.0 4. packing either one reel or five reels of photocoupler are packed in a shipping carton. 5. label indication the carton bears a label indicating the product number, the symbol representing classification of standard, the quantity, the lot number and the toshiba company name. 6. ordering method when placing an order, please specify the product number, the tape type and the quantity as shown in the following example. (example) e w1 w2 a b c u tl p104 (tp l ) 30 00 pcs device name tape type quantity (must be a multiple of 3000)
TLP104 201 5- 10 -16 13 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collectively "toshiba"), reserve the right to make changes to the i nformation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduced without prior written permission from toshiba. even with toshiba's written permission, reproduction is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and syste ms which minimize risk and avoid situations in which a malfunction or failure of product could cause loss of human life, bodi ly injury or damage to property, including data loss or corruption. before customers use the product, create designs including t he product, or incorporate the product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and conditions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be used with or for. customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted for use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific applications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or ex plosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance - related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse - engin eer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is presented only as guidance for product use. no responsibility is assumed by toshiba for any infringement of patents or any other intellectual property rights of third parties that may result from the use of product. n o license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? absent a written signed agreement, except as provided in the relevant terms and conditions of sale for product, and to the maximum extent allo wable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, consequential, special, or incidental damages or loss, including without limitation, loss of profits, loss of opportunities, business interruption and loss o f data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfr ingement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). product and related software and technology may be controlled under the applicable expor t laws and regulations including, without limitation, the japanese foreign exchange and foreign trade law and the u.s. export administration regulations. export and re - export of product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of product. please use product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled su bstances, including without limitation, the eu rohs direc tive. toshiba assumes no liability for damages or losse s occurring as a result of noncompliance w ith applicable laws and regulations.

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